Oracle launches host of new logistics innovation products

Two new products to help shippers develop scalable product lifecycle management (PLM) were introduced at the Oracle Value Chain Summit 2013 in San Francisco this week.

In an interview with LM, company executives outlined how Oracle’s Agile Lifecycle Management and Agile Lifecycle Process software can be used by organizations of all sizes and types to innovate profitably.

“Agile PLM 9.3.2 enhances usability and streamlines processes, while also introducing a range of new features within Agile PLM modules including our governance and compliance product,” said Richard Jewell, Oracle’s senior vice president, for supply chain application development. “There’s also tools here for shippers to manage cost and quality.”

Jewell added that the learning curve for the new offerings is “minimal,” and that shippers have been asking for more “plug-and-play” solutions.”

Enhancements and innovations in the latest release of Agile PLM include a new compliance engine that enhances Oracle’s “Design for REACH” capability and provides support for the new Conflict Mineral regulation within the Dodd–Frank Wall Street Reform and Consumer Protection Act.

“PLM has been an island of innovation for us,” said Jewell. “These products are to designed to help organizations further shorten cycle times, increase sales, lower costs and reduce risks associated with innovation.”

The Oracle Value Chain Summit comprises a variety of disciplines, said Jon Chorley, CSO and vice president, SCM product strategy and product value chain development.

“Besides the PLM summit, we have the manufacturing summit, maintenance summit, logistics Summit,” he said. “Furthermore, we’ve added a value chain planning and procurement summit, to create a more comprehensive conference.”

While the company will continue to stage its huge annual “Oracle OpenWorld,” summits like these will become more common, said Chorely.

“We like the intimacy they provide,” he said. “And it’s a good way to capture shipper feedback,”